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_______________________________________________________________ maxim integrated products 1 for pricing, delivery, and ordering information, please contact maxim direct at 1-888-629-4642, or visit maxims website at www.maxim-ic.com. 16-bit microcontroller with infrared module MAXQ613 19-5320; rev 0; 7/10 ordering information/selector guide general description the MAXQ613 is a low-power, 16-bit maxq ? microcon - troller designed for low-power applications including uni - versal remote controls, consumer electronics, and white goods. the device combines a powerful 16-bit risc microcontroller and integrated peripherals including a universal synchronous/asynchronous receiver-transmit - ter (usart) and an spi? master/slave communications port, along with an ir module with carrier frequency generation and flexible port i/o capable of multiplexed keypad control. the device includes 48kb of flash program memory and 1.5kb of data sram. intellectual property (ip) protec - tion is provided by a secure mmu that supports multiple application privilege levels and protects code against copying and reverse engineering. privilege levels enable vendors to provide libraries and applications to execute on the device, while limiting access to only data and code allowed by their privilege level. for the ultimate in low-power battery-operated perfor - mance, the device includes an ultra-low-power stop mode (0.2a typ). in this mode, the minimum amount of circuitry is powered. wake-up sources include external interrupts, the power-fail interrupt, and a timer interrupt. the microcontroller runs from a wide 1.70v to 3.6v oper - ating voltage. applications features s high-performance, low-power, 16-bit risc core s dc to 12mhz operation across entire operating range s 1.70v to 3.6v operating voltage s 33 total instructions for simplified programming s three independent data pointers accelerate data movement with automatic increment/decrement s dedicated pointer for direct read from code space s 16-bit instruction word, 16-bit data bus s 16 x 16-bit general-purpose working registers s secure mmu for application partitioning and ip protection s memory features 48kb program flash memory 512-byte sectors 20,000 erase/write cycles per sector masked rom available 1.5kb data sram s additional peripherals power-fail warning power-on reset (por)/brownout reset automatic ir carrier frequency generation and modulation two 16-bit programmable timers/counters with prescaler and capture/compare one spi and one usart port programmable watchdog timer 8khz nanopower ring oscillator wake-up timer up to 24 general-purpose i/os s low power consumption 0.2a (typ), 2.0a (max) in stop mode, t a = +25 n c, power-fail monitor disabled 2.0ma (typ) at 12mhz in active mode remote controls battery-powered portable equipment consumer electronics home appliances white goods + denotes a lead(pb)-free/rohs-compliant package. * ep = exposed pad. maxq is a registered trademark of maxim integrated products, inc. spi is a trademark of motorola, inc. note: some revisions of this device may incorporate deviations from published specifications known as errata. multiple revisions of any device may be simultaneously available through various sales channels. for information about device errata, go to: www.maxim-ic.com/errata . part temp range operating voltage (v) program memory (kb) data memory (kb) gpio pin-package MAXQ613a-0000+ 0 n c to +70 n c 1.7 to 3.6 48 flash 1.5 20 32 tqfn-ep* MAXQ613e-0000+ 0 n c to +70 n c 1.7 to 3.6 48 flash 1.5 20 32 lqfp MAXQ613j-0000+ 0 n c to +70 n c 1.7 to 3.6 48 flash 1.5 24 44 tqfn-ep* MAXQ613k-0000+ 0 n c to +70 n c 1.7 to 3.6 48 flash 1.5 24 44 tqfp MAXQ613x-0000+ 0 n c to +70 n c 1.7 to 3.6 48 flash 1.5 24 bare die
16-bit microcontroller with infrared module MAXQ613 2 ______________________________________________________________________________________ table of contents absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 spi electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 detailed description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 memory protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 stack memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 utility rom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ir carrier generation and modulation timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 carrier generation module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ir transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ir transmitindependent external carrier and modulator outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 ir receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 carrier burst-count mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16-bit timers/counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 usart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 serial peripheral interface (spi) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 general-purpose i/o . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 on-chip oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 rom loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 loading flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 in-application flash programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 in-circuit debug and jtag interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 power-fail detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 grounds and bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 additional documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 deviations from the maxq610 users guide for the MAXQ613 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 development and technical support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
16-bit microcontroller with infrared module MAXQ613 _______________________________________________________________________________________ 3 list of figures figure 1. ir transmit frequency shifting example (ircfme = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 2. ir transmit carrier generation and carrier modulator control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 3. ir transmission waveform (ircfme = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 4. external irtxm (modulator) output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 5. ir capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 6. receive burst-count example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 7. spi master communication timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 8. spi slave communication timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 9. on-chip oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 10. in-circuit debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 11. power-fail detection during normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 12. stop mode power-fail detection states with power-fail monitor enabled . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 13. stop mode power-fail detection with power-fail monitor disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 list of tables table 1. memory areas and associated maximum privilege levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 2. watchdog interrupt timeout (sysclk = 12mhz, cd[1:0] = 00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 3. usart mode details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 4. power-fail detection states during normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 5. stop mode power-fail detection states with power-fail monitor enabled . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 6. stop mode power-fail detection states with power-fail monitor disabled . . . . . . . . . . . . . . . . . . . . . . . . . . 26
16-bit microcontroller with infrared module MAXQ613 4 ______________________________________________________________________________________ stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. voltage range on v dd with respect to gnd ..... -0.3v to +3.6v voltage range on any lead with respect to gnd except v dd ............... -0.3v to (v dd + 0.5v) continuous power dissipation (t a = +70 n c) 32-pin tqfn (single-layer board) (derate 21.3mw/ n c above +70 n c) .......................... 1702.1mw 32-pin tqfn (multilayer board) (derate 34.5mw/ n c above +70 n c) .......................... 2758.6mw 32-pin lqfp (multilayer board) (derate 20.7mw/ n c above +70 n c) .......................... 1652.9mw 44-pin tqfn (single-layer board) (derate 27mw/ n c above +70 n c) ............................. 2162.2mw 44-pin tqfn (multilayer board) (derate 37mw/ n c above +70 n c) ................................ 2963mw 44-pin tqfp (multilayer board) (derate 19mw/ n c above +70 n c) ................................ 1504mw operating temperature range ............................. 0 n c to +70 n c storage temperature range ............................ -65 n c to +150 n c lead temperature (excluding dice; soldering, 10s) ...... +300 n c soldering temperature (reflow) ...................................... +260 n c recommended operating conditions (v dd = v rst to 3.6v, t a = 0 n c to +70 n c, unless otherwise noted.) (note 1) absolute maximum ratings parameter symbol conditions min typ max units supply voltage v dd v rst 3.6 v 1.8v internal regulator v reg18 1.62 1.8 1.98 v power-fail warning voltage for supply v pfw monitors v dd (note 2) 1.75 1.8 1.85 v power-fail reset voltage v rst monitors v dd (note 3) 1.64 1.67 1.70 v por voltage v por monitors v dd 1 1.42 v ram data-retention voltage v drv (note 4) 1.0 v active current i dd_1 sysclk = 12mhz (note 5) 3.25 4 ma stop-mode current i s1 power-fail off t a = +25 n c 0.2 2.0 f a t a = 0 c to +70 n c 0.2 8 i s2 power-fail on t a = +25 n c 22 29.5 t a = 0 c to +70 n c 27.6 42 current consumption during power-fail i pfr (note 6) [(3 x i s2 ) + ((pci - 3) x (i s1 + i nano ))]/pci f a power consumption during por i por (note 7) 100 na stop-mode resume time t on 375 + (8192 x t hfxin) f s power-fail monitor startup time t pfm_on (note 4) 150 f s power-fail warning detection time t pfw (note 8) 10 f s input low voltage for irtx, irrx, reset , and all port pins v il v gnd 0.3 x v dd v input high voltage for irtx, irrx, reset , and all port pins v ih 0.7 x v dd v dd v
16-bit microcontroller with infrared module MAXQ613 _______________________________________________________________________________________ 5 recommended operating conditions (continued) (v dd = v rst to 3.6v, t a = 0 n c to +70 n c, unless otherwise noted.) (note 1) parameter symbol conditions min typ max units input hysteresis (schmitt) v ihys v dd = 3.3v, t a = +25 n c 300 mv input low voltage for hfxin v il_hfxin v gnd 0.3 x v dd v input high voltage for hfxin v ih_hfxin 0.7 x v dd v dd v irrx input filter pulse-width reject t irrx_r 50 ns irrx input filter pulse-width accept t irrx_a 300 ns output low voltage for irtx v ol_irtx v dd = 3.6v, i ol = 25ma (note 3) 1.0 v v dd = 2.35v, i ol = 10ma (note 3) 1.0 v dd = 1.85v, i ol = 4.5ma 1.0 output low voltage for reset and all port pins (note 9) v ol v dd = 3.6v, i ol = 11ma (note 3) 0.4 0.5 v v dd = 2.35v, i ol = 8ma (note 3) 0.4 0.5 v dd = 1.85v, i ol = 4.5ma 0.4 0.5 output high voltage for irtx and all port pins v oh i oh = -2ma v dd - 0.5 v dd v input/output pin capacitance for all port pins c io (note 4) 15 pf input leakage current i l internal pullup disabled -100 +100 na input pullup resistor for reset , irtx, irrx, p0, p1, p2 r pu v dd = 3.0v, v ol = 0.4v (note 4) 16 28 39 k w v dd = 2.0v, v ol = 0.4v 17 30 41 external crystal/resonator crystal/resonator f hfxin 1 12 mhz crystal/resonator period t hfxin 1/f hfxin ns crystal/resonator warmup time t xtal_rdy from initial oscillation 8192 x t hfxin ms oscillator feedback resistor r oscf (note 4) 0.5 1.0 1.5 m w external clock input external clock frequency f xclk dc 12 mhz external clock period t xclk 1/f xclk ns external clock duty cycle t xclk_duty (note 4) 45 55 % system clock frequency f ck f hfxin mhz hfxout = gnd f xclk system clock period t ck 1/f ck ns nanopower ring nanopower ring frequency f nano t a = +25 n c 3.0 8.0 20.0 khz t a = +25 n c, v dd = por voltage (note 4) 1.7 2.4 nanopower ring duty cycle t nano (note 4) 40 60 % nanopower ring current i nano typical at v dd = 1.64v, t a = +25 c (note 4) 40 400 na
16-bit microcontroller with infrared module MAXQ613 6 ______________________________________________________________________________________ recommended operating conditions (continued) (v dd = v rst to 3.6v, t a = 0 n c to +70 n c, unless otherwise noted.) (note 1) spi electrical characteristics (v dd = v rst to 3.6v, t a = 0 n c to +70 n c, unless otherwise noted.) (note 11) parameter symbol conditions min typ max units wake-up timer wake-up timer interval t wakeup 1/f nano 65,535/ f nano s flash memory system clock during flash programming/erase f fpsysclk 6 mhz flash erase time t me mass erase 20 40 ms t erase page erase 20 40 flash programming time per word t prog (note 10) 20 100 f s write/erase cycles 20,000 cycles data retention t a = +25 n c 100 years ir carrier frequency f ir (note 4) f ck /2 hz parameter symbol conditions min typ max units spi master operating frequency 1/t mck f ck /2 mhz spi slave operating frequency 1/t sck f ck /4 mhz spi i/o rise/fall time t spi_rf c l = 15pf, pullup = 560 w 8.3 23.6 ns sclk output pulse-width high/low t mch , t mcl t mck /2 - t spi_rf ns mosi output hold time after sclk sample edge t moh t mck /2 - t spi_rf ns mosi output valid to sample edge t mov t mck /2 - t spi_rf ns miso input valid to sclk sample edge rise/fall setup t mis 25 ns miso input to sclk sample edge rise/fall hold t mih 0 ns sclk inactive to mosi inactive t mlh t mck /2 - t spi_rf ns sclk input pulse-width high/ low t sch , t scl t sck /2 ns ssel active to first shift edge t sse t spi_rf ns mosi input to sclk sample edge rise/fall setup t sis t spi_rf ns
16-bit microcontroller with infrared module MAXQ613 _______________________________________________________________________________________ 7 spi electrical characteristics ( continued ) (v dd = v rst to 3.6v, t a = 0 n c to +70 n c, unless otherwise noted.) (note 11) note 1: specifications to 0 n c are guaranteed by design and are not production tested. typical = +25 n c, v dd = +3.3v, unless otherwise noted. note 2: v pfw can be programmed to the following nominal voltage trip points: 1.8v, 1.9v, 2.55v, and 2.75v 3%. the values listed in the recommended operating conditions table are for the default configuration of 1.8v nominal. note 3: the power-fail reset and por detectors are designed to operate in tandem to ensure that one or both of these signals is active at all times when v dd < v rst , ensuring the device maintains the reset state until minimum operating voltage is achieved. note 4: guaranteed by design and not production tested. note 5: measured on the v dd pin and the device not in reset. all inputs are connected to gnd or v dd . outputs do not source/ sink any current. the device is executing code from flash memory. note 6: the power-check interval (pci) can be set to always on, or to 1024, 2048, or 4096 nanopower ring clock cycles. note 7: current consumption during por when powering up while v dd is less than the por release voltage. note 8: the minimum amount of time that v dd must be below v pfw before a power-fail event is detected; refer to the maxq610 users guide for details. note 9: the maximum total current, i oh(max) and i ol(max) , for all listed outputs combined should not exceed 32ma to satisfy the maximum specified voltage drop. this does not include the irtx output. note 10: programming time does not include overhead associated with utility rom interface. note 11: ac electrical specifications are guaranteed by design and are not production tested. parameter symbol conditions min typ max units mosi input from sclk sample edge transition hold t sih t spi_rf ns miso output valid after sclk shift edge transition t sov 2t spi_rf ns ssel inactive t ssh t ck + t spi_rf ns sclk inactive to ssel rising t sd t spi_rf ns miso output disabled after ssel edge rise t slh 2t ck + 2t spi_rf ns
16-bit microcontroller with infrared module MAXQ613 8 ______________________________________________________________________________________ pin configurations tqfn (5mm 5mm) top view 29 30 28 27 12 11 13 p0.1/rx/int9 p0.3/int11 p0.4/int12 p0.5/tba0/tba1/int13 p0.6/tbb0/int14 14 p0.0/irtxm/int8 n.c. p1.7/int7 p1.6/int6 p2.4/tck hfxout hfxin 1 2 reset 4 5 6 7 23 24 22 20 19 18 v dd gnd regout gnd p1.3/int3 p1.2/int2 p0.2/tx/int10 gnd 3 + 21 31 10 irtx ep p1.1/int1 32 9 irrx p1.0/int0 p2.7/tdo 26 15 v dd p2.6/tms 25 16 p1.4/int4 p0.7/tbb1/int15 p1.5/int5 8 17 p2.5/tdi MAXQ613 lqfp (7mm 7mm) top view 29 30 28 27 12 11 13 p0.1/rx/int9 p0.3/int11 p0.4/int12 p0.5/tba0/tba1/int13 p0.6/tbb0/int14 14 p0.0/irtxm/int8 n.c. p1.7/int7 p1.6/int6 p2.4/tck hfxout hfxin 1 2 reset 4 5 6 7 23 24 22 20 19 18 v dd gnd regout gnd p1.3/int3 p1.2/int2 p0.2/tx/int10 gnd 3 21 31 10 irtx p1.1/int1 32 9 irrx p1.0/int0 p2.7/tdo 26 15 v dd p2.6/tms 25 16 p1.4/int4 p0.7/tbb1/int15 p1.5/int5 8 17 p2.5/tdi MAXQ613 + p0.1/rx/int9 n.c. p0.2/tx/int10 p0.3/int11 p0.4/int12 p0.5/tba0/tba1/int13 p0.6/tbb0/int14 p0.7/tbb1/int15 p1.0/int0 n.c. p0.0/irtxm/int8 1 2 3 4 5 6 7 8 9 10 11 n.c. n.c. p2.6/tms p2.7/tdo reset v dd gnd irtx irrx p2.5/tdi p2.4/tck 34 35 36 37 38 39 40 41 42 43 44 gnd v dd regout gnd n.c. n.c. p1.3/int3 p1.2/int2 p1.1/int1 p1.4/int4 p1.5/int5 22 21 20 19 18 17 16 15 14 13 12 n.c. n.c. p2.1/miso gnd p2.0/mosi p1.7/int7 p1.6/int6 hfxout hfxin p2.2/sclk p2.3/ssel 33 32 31 30 29 28 27 26 25 24 23 tqfn (7mm 7mm) top view + ep MAXQ613
16-bit microcontroller with infrared module MAXQ613 _______________________________________________________________________________________ 9 pin configurations (continued) pin description tqfp (10mm 10mm) top view 12 p1.1/int1 13 p1.2/int2 14 p1.3/int3 15 n.c. 16 n.c. 17 gnd 18 regout 19 v dd 20 gnd 21 p1.4/int4 22 p1.5/int5 p2.3/ssel 33 hfxout 24 hfxin 23 p1.6/int6 25 p1.7/int7 26 p2.0/mosi 27 gnd 28 p2.1/miso 29 n.c. 30 n.c. 31 p2.2/sclk 32 p0.0/irtxm/int8 1 n.c. 2 p0.1/rx/int9 3 n.c. 4 p0.2/tx/int10 5 p0.3/int11 6 p0.4/int12 7 p0.5/tba0/tba1/int13 8 p0.6/tbb0/int14 9 p1.0/int0 11 p0.7/tbb1/int15 10 34 p2.4/tck 44 irrx 43 irtx note: contact factory for bare die pad configuration. 42 gnd 41 v dd 40 reset 39 p2.7/tdo 38 p2.6/tms 37 n.c. 36 n.c. 35 p2.5/tdi MAXQ613 + pin name function bare die 32 tqfn- ep/lqfp 44 tqfn- ep/tqfp power pins 15, 37 15, 29 19, 41 v dd supply voltage 13, 16, 25, 38 13, 22, 30 17, 20, 28, 42 gnd ground. connect directly to the ground plane. 14 14 18 regout 1.8v regulator output. this pin must be connected to ground through a 1.0 f f (esr: 2 w w
16-bit microcontroller with infrared module MAXQ613 10 _____________________________________________________________________________________ pin description (continued) pin name function bare die 32 tqfn- ep/lqfp 44 tqfn- ep/tqfp reset pin 36 28 40 reset digital, active-low, reset input/output. the device remains in reset as long as this pin is low and begins executing from the utility rom at address 8000h when this pin returns to a high state. the pin includes pullup current source; if this pin is driven by an external device, it should be driven by an open-drain source capable of sinking in excess of 4ma. this pin can be left unconnected if there is no need to place the device in a reset state using an external signal. this pin is driven low as an output when an internal reset condition occurs. clock pins 20 18 23 hfxin high-frequency crystal input. connect an external crystal or resona - tor between hfxin and hfxout for use as the high-frequency system clock. alternatively, hfxin is the input for an external, high-frequency clock source when hfxout is unconnected. 21 19 24 hfxout ir function pins 39 31 43 irtx ir transmit output. ir transmission pin capable of sinking 25ma. this pin defaults to a high-impedance input with the weak pullup disabled during all forms of reset. software must configure this pin after release from reset to remove the high-impedance input condition. 40 32 44 irrx ir receive input. this pin defaults to a high-impedance input with the weak pullup disabled during all forms of reset. software must configure this pin after release from reset to remove the high-impedance input condition. general-purpose i/o and special function pins port 0 general-purpose, digital i/o pins. these port pins function as general-purpose i/o pins with their input and output states controlled by the pd0, po0, and pi0 registers. all port pins default to high-impedance mode after a reset. software must configure these pins after release from reset to remove the high-impedance condition. all alternate func - tions must be enabled from software before they can be used. gpio port pin special function 1 1 1 p0.0/irtxm/ int8 p0.0 ir modulator output/int8 2 2 3 p0.1/rx/ int9 p0.1 usart receive/int9 3 3 5 p0.2/tx/ int10 p0.2 usart transmit/int10 4 4 6 p0.3/int11 p0.3 int11 5 5 7 p0.4/int12 p0.4 int12 6 6 8 p0.5/tba0/ tba1/int13 p0.5 type b timer 0 pin a or type b timer 1 pin a/int13
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 11 pin description (continued) pin name function bare die 32 tqfn- ep/lqfp 44 tqfn- ep/tqfp 7 7 9 p0.6/tbb0/ int14 p0.6 type b timer 0 pin b/int14 8 8 10 p0.7/tbb1/ int15 p0.7 type b timer 1 pin b/int15 port 1 general-purpose, digital i/o pins with interrupt capability. these port pins function as general-purpose i/o pins with their input and out - put states controlled by the pd1, po1, and pi1 registers. all port pins default to high-impedance mode after a reset. software must configure these pins after release from reset to remove the high-impedance con - dition. all external interrupts must be enabled from software before they can be used. gpio port pin external interrupt 9 9 11 p1.0/int0 p1.0 int0 10 10 12 p1.1/int1 p1.1 int1 11 11 13 p1.2/int2 p1.2 int2 12 12 14 p1.3/int3 p1.3 int3 17 16 21 p1.4/int4 p1.4 int4 18 17 22 p1.5/int5 p1.5 int5 22 20 25 p1.6/int6 p1.6 int6 23 21 26 p1.7/int7 p1.7 int7 port 2 general-purpose, digital i/o pins. these port pins function as general-purpose i/o pins with their input and output states controlled by the pd2, po2, and pi2 registers. all port pins default to high-impedance mode after a reset. software must configure these pins after release from reset to remove the high-impedance condition. all special func - tions must be enabled from software before they can be used. gpio port pin special function 24 27 p2.0/mosi p2.0 spi: master out-slave in 26 29 p2.1/miso p2.1 spi: master in-slave out 28 32 p2.2/sclk p2.2 spi: slave clock 30 33 p2.3/ ssel p2.3 spi: active-low slave select 31 24 34 p2.4/tck p2.4 jtag: test clock 33 25 35 p2.5/tdi p2.5 jtag: test data in 34 26 38 p2.6/tms p2.6 jtag: test mode select 35 27 39 p2.7/tdo p2.7 jtag: test data out no connection pins 23 2, 4, 15, 16, 30, 31, 36, 37 n.c. no connection. not internally connected.
16-bit microcontroller with infrared module MAXQ613 12 _____________________________________________________________________________________ detailed description the MAXQ613 provides integrated, low-cost solutions that simplify the design of ir communications equipment such as universal remote controls. standard features include the highly optimized, single-cycle, maxq, 16-bit risc core; 48kb of program flash memory; 1.5kb data ram; soft stack; 16 general-purpose registers; and three data pointers. the maxq core has the industrys best mips/ma rating, allowing developers to achieve the same performance as competing microcontrollers at substantially lower clock rates. lower active-mode current combined with the even lower MAXQ613 stop- mode current (0.2 f a typ) results in increased battery life. application-specific peripherals include flexible timers for generating ir carrier frequencies and modulation. a high-current ir drive pin capable of sinking up to 25ma current and output pins capable of sinking up to 5ma are ideal for ir applications. it also includes general- purpose i/o pins ideal for keypad matrix input, and a power-fail-detection circuit to notify the application when the supply voltage is nearing the microcontrollers mini - mum operating voltage. at the heart of the device is the maxq 16-bit, risc core. operating from dc to 12mhz, almost all instructions exe - cute in a single clock cycle (83.3ns at 12mhz), enabling nearly 12mips true-code operation. when active device operation is not required, an ultra-low-power stop mode can be invoked from software, resulting in quiescent current consumption of less than 0.2 f a (typ) and 2.0 f a (max). the combination of high-performance instructions and ultra-low stop-mode current increases battery life over competing microcontrollers. an integrated por cir - cuit with brownout support resets the device to a known condition following a power-up cycle or brownout condi - tion. additionally, a power-fail warning flag is set, and a power-fail interrupt can be generated when the system voltage falls below the power-fail warning voltage, v pfw . the power-fail warning feature allows the application to notify the user that the system supply is low and appro - priate action should be taken. microprocessor the device is based on maxims low-power, 16-bit maxq family of risc cores. the core supports the harvard memory architecture with separate 16-bit program and data address buses. a fixed 16-bit instruction word is standard, but data can be arranged in 8 or 16 bits. the maxq core in the device is implemented as a pipe - lined processor with performance approaching 1mips per mhz. the 16-bit data path is implemented around register modules, and each register module contributes specific functions to the core. the accumulator module consists of sixteen 16-bit registers and is tightly coupled with the arithmetic logic unit (alu). a configurable soft stack supports program flow. execution of instructions is triggered by data transfer between functional register modules or between a func - tional register module and memory. because data move - ment involves only source and destination modules, circuit switching activities are limited to active modules only. for power-conscious applications, this approach localizes power dissipation and minimizes switching noise. the modular architecture also provides a maxi - mum of flexibility and reusability that are important for a microprocessor used in embedded applications. the maxq instruction set is highly orthogonal. all arith - metical and logical operations can use any register in conjunction with the accumulator. data movement is supported from any register to any other register. memory is accessed through specific data-pointer reg - isters with autoincrement/decrement support. block diagram 16-bit maxq risc cpu 5.5kb data sram usart 8khz nano ring 2x 16-bit timer gpio voltage monitor clock 48kb flash memory ir timer watchdog 1.5kb utility rom spi ir driver regulator MAXQ613
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 13 memory the microcontroller incorporates several memory types: ? 48kb program flash memory ? 1.5kb sram data memory ? 5.5kb utility rom ? soft stack memory protection the optional memory-protection feature separates code memory into three areas: system, user loader, and user application. code in the system area can be kept con - fidential. code in the user areas can be prevented from reading and writing system code. the user loader can also be protected from user application code. memory protection is implemented using privilege levels for code. each area has an associated privilege level. ram/rom are assigned privilege levels as well. refer to the maxq610 users guide for a more thorough expla - nation of the topic. see table 1. stack memory the device provides a soft stack that can be used to store program return addresses (for subroutine calls and interrupt handling) and other general-purpose data. this soft stack is located in the 1.5kb sram data memory, which means that the sram data memory must be shared between the soft stack and general-purpose application data storage. however, the location and size of the soft stack is determined by the user, provid - ing maximum flexibility when allocating resources for a particular application. the stack is used automatically by the processor when the call, ret, and reti instruc - tions are executed and when an interrupt is serviced. an application can also store and retrieve values explicitly using the stack by means of the push, pop, and popi instructions. the sp pointer indicates the current top of the stack, which initializes by default to the top of the sram data memory. as values are pushed onto the stack, the sp pointer decrements, which means that the stack grows downward towards the bottom (lowest address) of the data memory. popping values off the stack causes the sp pointer value to increase. refer to the maxq610 users guide for more details. utility rom the utility rom is a 5.5kb block of internal rom memory located in program space beginning at address 8000h. this rom includes the following routines: ? in-system programming (bootstrap loader) using jtag interface ? in-circuit debugging routines using jtag interface ? production test routines (internal memory tests, memory loader, etc.), which are used for internal testing only, and are generally of no use to the end- application developer ? user-callable routines for in-application flash program - ming, buffer copying, and fast table lookup (more information on these routines can be found in the maxq610 users guide) following any reset, execution begins in the utility rom at address 8000h. at this point, unless loader mode or test mode has been invoked (which requires special pro - gramming through the jtag interface), the utility rom in the device always automatically jumps to location 0000h, which is the beginning of user application code in pro - gram flash memory. some applications require protection against unauthor - ized viewing of program code memory. for these appli - cations, access to in-system programming, in-applica - tion programming, or in-circuit debugging functions is prohibited until a password has been supplied. three table 1. memory areas and associated maximum privilege levels area page address maximum privilege level system 0 to uldr-1 high user loader uldr to uapp-1 medium user application uapp to top low utility rom n/a high other (ram) n/a low
16-bit microcontroller with infrared module MAXQ613 14 _____________________________________________________________________________________ different password locks are provided, each of which can be used to protect a different area of memory (sys - tem memory, user loader, and user application). each password lock is controlled by a 16-word area of flash memory; if the password is set to all ffffh values or all 0000h values, the password is disabled. otherwise, the password is active and must be matched by the user of the bootloader or debugger before access is granted to the corresponding area of flash program memory. refer to the maxq610 users guide for more details. watchdog timer the internal watchdog timer greatly increases system reliability. the timer resets the device if software execu - tion is disturbed. the watchdog timer is a free-running counter designed to be periodically reset by the applica - tion software. if software is operating correctly, the coun - ter is periodically reset and never reaches its maximum count. however, if software operation is interrupted, the timer does not reset, triggering a system reset and optionally a watchdog timer interrupt. this protects the system against electrical noise or electrostatic discharge (esd) upsets that could cause uncontrolled processor operation. the internal watchdog timer is an upgrade to older designs with external watchdog devices, reducing system cost and simultaneously increasing reliability. the watchdog timer functions as the source of both the watchdog timer timeout and the watchdog timer reset. the timeout period can be programmed in a range of 2 15 to 2 24 system clock cycles. an interrupt is gener - ated when the timeout period expires if the interrupt is enabled. all watchdog timer resets follow the pro - grammed interrupt timeouts by 512 system clock cycles. if the watchdog timer is not restarted for another full interval in this time period, a system reset occurs when the reset timeout expires. see table 2. ir carrier generation and modulation timer the dedicated ir timer/counter module simplifies low- speed infrared (ir) communication. the ir timer imple - ments two pins (irtx and irrx) for supporting ir transmit and receive, respectively. the irtx pin has no corresponding port pin designation, so the standard pd, po, and pi port control status bits are not present. however, the irtx pin output can be manipulated high or low using the pwcn.irtxout and pwcn.irtxoe bits when the ir timer is not enabled (i.e., iren = 0). the ir timer is composed of a carrier generator and a carrier modulator. the carrier generation module uses the 16-bit ir carrier register (irca) to define the high and low time of the carrier through the ir carrier high byte (ircah) and ir carrier low byte (ircal). the carrier modulator uses the ir data bit (irdata) and ir modula - tor time register (irmt) to determine whether the carrier or the idle condition is present on irtx. the ir timer is enabled when the ir enable bit (iren) is set to 1. the ir value register (irv) defines the begin - ning value for the carrier modulator. during transmission, the irv register is initially loaded with the irmt value and begins down counting towards 0000h, whereas in receive mode it counts upward from the initial irv register value. during the receive operation, the irv register can be configured to reload with 0000h when capture occurs on detection of selected edges or can be allowed to continue free-running throughout the receive operation. an overflow occurs when the ir timer value rolls over from 0ffffh to 0000h. the ir overflow flag (irov) is set to 1 and an interrupt is generated if enabled (irie = 1). table 2. watchdog interrupt timeout (sysclk = 12mhz, cd[1:0] = 00) wd[1:0] watchdog clock watchdog interrupt timeout watchdog reset after watchdog interrupt ( s) 00 sysclk/2 15 2.7ms 42.7 01 sysclk/2 18 21.9ms 42.7 10 sysclk/2 21 174.7ms 42.7 11 sysclk/2 24 1.4s 42.7
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 15 carrier generation module the ircah byte defines the carrier high time in terms of the number of ir input clocks, whereas the ircal byte defines the carrier low time. ? ir input clock (f irclk ) = f sys /2 irdiv[1:0] ? carrier frequency (f carrier ) = f irclk /(ircah + ircal + 2) ? carrier high time = ircah + 1 ? carrier low time = ircal + 1 ? carrier duty cycle = (ircah + 1)/(ircah + ircal + 2) during transmission, the irca register is latched for each irv down-count interval, and is sampled along with the irtxpol and irdata bits at the beginning of each new irv down-count interval so that duty-cycle variation and frequency shifting is possible from one interval to the next, which is illustrated in figure 1. figure 2 illustrates the basic carrier generation and its path to the irtx output pin. the ir transmit polarity bit (irtxpol) defines the starting/idle state and the carrier polarity of the irtx pin when the ir timer is enabled. ir transmission during ir transmission (irmode = 1), the carrier gen - erator creates the appropriate carrier waveform, while the carrier modulator performs the modulation. the car - rier modulation can be performed as a function of carrier cycles or irclk cycles dependent on the setting of the ircfme bit. when ircfme = 0, the irv down counter is clocked by the carrier frequency and thus the modula - tion is a function of carrier cycles. when ircfme = 1, the irv down counter is clocked by irclk, allowing carrier modulation timing with irclk resolution. the irtxpol bit defines the starting/idle state as well as the carrier polarity for the irtx pin. if irtxpol = 1, the figure 1. ir transmit frequency shifting example (ircfme = 0) carrier output (irv) irdata ir interrupt 0 1 irmt = 3 0 irtx irtxpol = 1 irtx irtxpol = 0 irca irmt irmt = 5 irca = 0202h irca = 0002h irca, irmt, irdata sampled at end of irv down-count interval 3 1 2 0 5 4 3 2 1 0
16-bit microcontroller with infrared module MAXQ613 16 _____________________________________________________________________________________ irtx pin is set to a logic-high when the ir timer module is enabled. if irtxpol = 0, the irtx pin is set to a logic-low when the ir timer is enabled. a separate register bit, ir data (irdata), is used to determine whether the carrier generator output is output to the irtx pin for the next irmt carrier cycles. when irdata = 1, the carrier waveform (or inversion of this waveform if irtxpol = 1) is output on the irtx pin dur - ing the next irmt cycles. when irdata = 0, the idle condition, as defined by irtxpol, is output on the irtx pin during the next irmt cycles. the ir timer acts as a down counter in transmit mode. an ir transmission starts when the iren bit is set to 1 when irmode = 1; when the irmode bit is set to 1 when iren = 1; or when iren and irmode are both set to 1 in the same instruction. the irmt and irca registers, along with the irdata and irtxpol bits, are sampled at the beginning of the transmit process and every time the ir figure 2. ir transmit carrier generation and carrier modulator control figure 3. ir transmission waveform (ircfme = 0) 1 0 0 1 sample irdata on irv = 0000h carrier modulation carrier generation carrier irclk ircfme ircal + 1 ircah + 1 irdata irmt irtxpol irtx pin ir interrupt carrier output (irv) irdata ir interrupt irtx irtxpol = 1 irtx irtxpol = 0 0 1 0 irmt = 3 2 3 1 0 2 3 1 0
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 17 figure 4. external irtxm (modulator) output timer value reloads its value. when the irv reaches 0000h value, on the next carrier clock, it does the following: 1) reloads irv with irmt. 2) samples irca, irdata, and irtxpol. 3) generates irtx accordingly. 4) sets irif to 1. 5) generates an interrupt to the cpu if enabled (irie = 1). to terminate the current transmission, the user can switch to receive mode (irmode = 0) or clear iren to 0. carrier modulation time = irmt + 1 carrier cycles ir transmitindependent external carrier and modulator outputs the normal transmit mode modulates the carrier based upon the irdata bit. however, the user has the option to input the modulator (envelope) on an external pin if desired. if the irenv[1:0] bits are configured to 01b or 10b, the modulator/envelope is output to the irtxm pin. the irdata bit is output directly to the irtxm pin (if irtxpol = 0) on each irv down-count interval bound - ary just as if it were being used to internally modulate the carrier frequency. if irtxpol = 1, the inverse of the irdata bit is output to the irtxm pin on the irv interval down-count boundaries. see figure 4. when the envelope mode is enabled, it is possible to output either the modulated (irenv[1:0] = 01b) or unmodulated (inenv[1:0] = 10b) carrier to the irtx pin. ir receive when configured in receive mode (irmode = 0), the ir hardware supports the irrx capture function. the irrxsel[1:0] bits define which edge(s) of the irrx pin should trigger the ir timer capture function. the ir module starts operating in the receive mode when irmode = 0 and iren = 1. once started, the ir timer (irv) starts up counting from 0000h when a qualified capture event as defined by irrxsel happens. the irv register is, by default, counting carrier cycles as defined by the irca register. however, the ir carrier frequency detect (ircfme) bit can be set to 1 to allow clocking of the irv register directly with the irclk for finer resolu - tion. when ircfme = 0, the irca defined carrier is counted by irv. when ircfme = 1, the irclk clocks the irv register. on the next qualified event, the ir module does the following: 1) captures the irrx pin state and transfers its value to irdata. if a falling edge occurs, irdata = 0. if a rising edge occurs, irdata = 1. 2) transfers its current irv value to the irmt. 3) resets irv content to 0000h (if irxrl = 1). 4) continues counting again until the next qualified event. if the ir timer value rolls over from 0ffffh to 0000h before a qualified event happens, the ir timer overflow (irov) flag is set to 1 and an interrupt is generated, if irdata ir interrupt irv interval irtxm irtxpol = 1 irtxm irtxpol = 0 irmt irmt irmt irmt 0 1 0 1 0 1 0 1
16-bit microcontroller with infrared module MAXQ613 18 _____________________________________________________________________________________ enabled. the ir module continues to operate in receive mode until it is stopped by switching into transmit mode (irmode = 1) or clearing iren = 0. carrier burst-count mode a special mode reduces the cpu processing burden when performing ir learning functions. typically, when operating in an ir learning capacity, some number of carrier cycles are examined for frequency determina - tion. once the frequency has been determined, the ir receive function can be reduced to counting the number of carrier pulses in the burst and the duration of the combined mark-space time within the burst. to simplify this process, the receive burst-count mode (as enabled by the rxbcnt bit) can be used. when rxbcnt = 0, the standard ir receive capture functionality is in place. when rxbcnt = 1, the irv capture operation is dis - abled and the interrupt flag associated with the capture no longer denotes a capture. in the carrier burst-count mode, the irmt register only counts qualified edges. the irif interrupt flag (normally used to signal a capture when rxbcnt = 0) now becomes set if two irca cycles elapse without getting a qualified edge. the irif inter - rupt flag thus denotes absence of the carrier and the beginning of a space in the receive signal. when the rxbcnt bit is changed from 0 to 1, the irmt register is set to 0001h. the ircfme bit is still used to define whether the irv register is counting system irclk clocks or irca-defined carrier cycles. the irxrl bit defines whether the irv register is reloaded with 0000h on detection of a qualified edge (per the irxsel[1:0] bits). figure 6 and the descriptive sequence embedded in the figure illustrate the expected usage of the receive burst-count mode. 16-bit timers/counters the microcontroller provides two timers/counters that support the following functions: ? 16-bit timer/counter ? 16-bit up/down autoreload ? counter function of external pulse ? 16-bit timer with capture ? 16-bit timer with compare ? input/output enhancements for pulse-width modulation ? set/reset/toggle output state on comparator match ? prescaler with 2n divider (for n = 0, 2, 4, 6, 8, 10) usart the device provides a usart peripheral with the follow - ing features: ? 2-wire interface ? full-duplex operation for asynchronous data transfers ? half-duplex operation for synchronous data transfers ? programmable interrupt when transmit or receive data operation completes ? independent programmable baud-rate generator ? optional 9th bit parity support ? start/stop bit support figure 5. ir capture 0 1 0000h irv carrier modulation carrier generation irclk ircfme ircal + 1 ircah + 1 interrupt to cpu irdata irrx pin reset irv to 0000h ir timer overflow ir interrupt irxrl copy irv to irmt on edge detect edge detect
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 19 table 3. usart mode details figure 6. receive burst-count example serial peripheral interface (spi) the integrated spi provides an independent serial communication channel that communicates synchro - nously with peripheral devices in a multiple master or multiple slave system. the interface allows access to a 4-wire, full-duplex serial bus, and can be operated in either master mode or slave mode. collision detection is provided when two or more masters attempt a data transfer at the same time. the maximum spi master transfer rate is sysclk/2. when operating as an spi slave, the device can support up to sysclk/4 spi transfer rate. data is transferred as an 8-bit or 16-bit value, msb first. in addition, the spi module supports configuration of an active ssel state (active low or active high) through the slave active select. mode type start bits data bits stop bits mode 0 synchronous n/a 8 n/a mode 1 asynchronous 1 8 1 mode 2 asynchronous 1 8 + 1 1 mode 3 asynchronous 1 8 + 1 1 1 1 4 5 6 7 8 9 to 2 3 4 6 7 5 8 9 carrier frequency calculation irrx irv irmt irmt = pulse counting irmt = pulse counting irv = carrier cycle counting capture interrupt (irif = 1). irv irmt. irv = 0 (if irxrl = 1). software sets irca = carrier frequency. software sets rxbcnt = 1 (which clears irmt = 0001 in hardware). software clears ircfme = 0 so that irv counts carrier cycles. irv is reset to 0 on qualified edge detection if irxrl = 1. software adds to irmt the number of pulses used for carrier measurement. irca x 2x counter for space can begin immediately (qualified edge resets). qualified edge detected: irmt++ irv reset to 0 if irxrl = 1. irca x 2 period elapses: irif = 1; carrier absence = space. burst mark = irmt pulses. software clears rxbcnt = 0 so that we capture on the next qualified edge. qualified edge detected: irif = 1, capture irv irmt as the burst space (plus up to one carrier cycle). software set rxbcnt = 1 as in (5). continue (5) to (8) until learning space exceeds some duration. irv rollovers can be used.
16-bit microcontroller with infrared module MAXQ613 20 _____________________________________________________________________________________ figure 7. spi master communication timing figure 8. spi slave communication timing ssel sclk ckpol/ckpha 0/1 or 1/0 sclk ckpol/ckpha 0/0 or 1/1 mosi miso lsb lsb shift sample shift sample t mck t mch t moh t mis t mov t rf t mlh t mih t mcl msb msb-1 msb msb-1 shift sample shift sample ssel sclk ckpol/ckpha 0/1 or 1/0 sclk ckpol/ckpha 0/0 or 1/1 mosi miso t sse t sck t sch t scl t sis t sov t slh t ssh t sd t rf t sih msb msb-1 msb msb-1 lsb lsb
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 21 general-purpose i/o the microcontroller provides port pins for general-pur - pose i/o that have the following features: ? cmos output drivers ? schmitt trigger inputs ? optional weak pullup to v dd when operating in input mode while the microcontroller is in a reset state, all port pins become high impedance with both weak pullups and input buffers disabled, unless otherwise noted. from a software perspective, each port appears as a group of peripheral registers with unique addresses. special function pins can also be used as general-pur - pose i/o pins when the special functions are disabled. for a detailed description of the special functions avail - able for each pin, refer to the maxq610 users guide . on-chip oscillator an external quartz crystal or a ceramic resonator can be connected between hfxin and hfxout, as illustrated in figure 9. noise at hfxin and hfxout can adversely affect on- chip clock timing. it is good design practice to place the crystal and capacitors near the oscillator circuitry and connect hfxin and hfxout to ground with a direct short trace. the typical values of external capacitors vary with the type of crystal to be used and should be initially selected based on load capacitance as suggested by the manufacturer. rom loader the rom loader denies access to the system, user load - er, or user-application memories unless an area-specific password is provided. the rom loader is not available in rom-only versions. loading flash memory an internal bootstrap loader allows reloading over a simple jtag interface. as a result, software can be upgraded in-system, eliminating the need for a costly hardware retrofit when updates are required. remote software uploads are possible that enable physically inaccessible applications to be frequently updated. the interface hardware can be a jtag connection to another microcontroller, or a connection to a pc serial port using a serial-to-jtag converter such as the maxqjtag-001, available from maxim. if in-system programmability is not required, a commercial gang programmer can be used for mass programming. activating the jtag interface and loading the test access port (tap) with the system programming instruction invokes the bootstrap loader. setting the spe bit to one during reset through the jtag interface executes the bootstrap-loader mode program that resides in the utility rom. when programming is complete, the bootstrap loader can clear the spe bit and reset the device, allowing the device to bypass the utility rom and begin execution of the application software. in addition, the rom loader also enforces the memory- protection policies. passwords that are 16 words are required to access the rom loader interface. loading memory is not possible for rom-only versions of the device. in-application flash programming from user-application code, flash memory can be pro - grammed using the rom utility functions from either c or assembly language. the function declarations below show examples of some of the rom utility functions provided for in-application flash memory programming: /* write one 16-bit word to code address dest. * dest must be aligned to 16 bits. * returns 0 = failure, 1 = ok. */ int flash_write (uint16_t dest, uint16_t data); figure 9. on-chip oscillator v dd hfxin clock circuit r f = 1mi q50% c1 = c2 = 12pf stop hfxout c2 c1 r f
16-bit microcontroller with infrared module MAXQ613 22 _____________________________________________________________________________________ to erase, the following function would be used: /* erase the given flash page * addr: flash offset (anywhere within page) */ int flash_erasepage(uint16_t addr); the in-application flash memory programming must call rom utility functions to erase and program any of the flash memory. memory protection is enforced by the rom utility functions. in-application is not available in rom-only versions of the device. in-circuit debug and jtag interface embedded debug hardware and software are devel - oped and integrated to provide full in-circuit debugging capability in a user-application environment. these hard - ware and software features include the following: ? debug engine ? set of registers providing the ability to set breakpoints on register, code, or data using debug service rou - tines stored in rom collectively, these hardware and software features sup - port two modes of in-circuit debug functionality: ? background mode: cpu is executing the normal user program allows the host to configure and set up the in-circuit debugger ? debug mode: debugger takes over the control of the cpu read/write accesses to internal registers and memory single-step of the cpu for trace operation the interface to the debug engine is the tap control - ler. the interface allows for communication with a bus master that can either be automatic test equipment or a component that interfaces to a higher level test bus as part of a complete system. the communication operates across a 4-wire serial interface from a dedicated tap that is compatible with the jtag ieee standard 1149. the tap provides an independent serial channel to com - municate synchronously with the host system. to prevent unauthorized access of the protected memo - ry regions through the jtag interface, the debug engine prevents modification of the privilege registers and disallows all access to system memory, unless memory protection is disabled. in addition, all services (such as register display or modification) are denied when code is executing inside the system area. the debugger is not available for rom-only versions of the device. operating modes the lowest power mode of operation is stop mode. in this mode, cpu state and memories are preserved, but the cpu is not actively running. wake-up sources include external i/o interrupts, the power-fail warning interrupt, wake-up timer, or a power-fail reset. any time the micro - controller is in a state where code does not need to be executed, the user software can put the device into stop mode. the nanopower ring oscillator is an internal ultra- low-power (400na) 8khz ring oscillator that can be used to drive a wake-up timer that exits stop mode. the wake- up timer is programmable by software in steps of 125 f s up to approximately 8s. the power-fail monitor is always on during normal opera - tion. however, it can be selectively disabled during stop mode to minimize power consumption. this feature is enabled using the power-fail monitor disable (pfd) bit in the pwcn register. the reset default state for the pfd bit is 1, which disables the power-fail monitor function during stop mode. if power-fail monitoring is disabled (pfd = 1) during stop mode, the circuitry responsible for generating a power-fail warning or reset is shut down and neither condition is detected. thus, the v dd < v rst condition does not invoke a reset state. figure 10. in-circuit debugger tap controller cpu debug engine debug service routines (utility rom) control breakpoint address data MAXQ613 tms tck tdi tdo
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 23 power-fail detection figures 11, 12, and 13 show the power-fail detection and response during normal and stop-mode operation. if a reset is caused by a power-fail, the power-fail monitor can be set to one of the following intervals: ? always oncontinuous monitoring ? 2 11 nanopower ring oscillator clocks (~256ms) ? 2 12 nanopower ring oscillator clocks (~512ms) ? 2 13 nanopower ring oscillator clocks (~1.024s) in the case where the power-fail circuitry is periodically turned on, the power-fail detection is turned on for two nanopower ring-oscillator cycles. if v dd > v rst during detection, v dd is monitored for an additional nanopower ring-oscillator period. if v dd remains above v rst for the third nanopower ring period, the cpu exits the reset state and resumes normal operation from utility rom at 8000h after satisfying the crystal warmup period. if a reset is generated by any other event, such as the reset pin being driven low externally or the watchdog timer, the power-fail, internal regulator, and crystal remain on during the cpu reset. in these cases, the cpu exits the reset state in less than 20 crystal cycles after the reset source is removed. figure 11. power-fail detection during normal operation a b c d f g h i e v dd v pfw v rst v por internal reset (active high) t < t pfw t t pfw t t pfw t t pfw
16-bit microcontroller with infrared module MAXQ613 24 _____________________________________________________________________________________ table 4. power-fail detection states during normal operation state power-fail internal regulator crystal oscillator sram retention comments a on off off v dd < v por . b on on on v por < v dd < v rst . crystal warmup time, t xtal_rdy . cpu held in reset. c on on on v dd > v rst . cpu normal operation. d on on on power drop too short. power-fail not detected. e on on on v rst < v dd < v pfw . pfi is set when v rst < v dd < v pfw and maintains this state for at least t pfw , at which time a power-fail interrupt is gener - ated (if enabled). cpu continues normal operation. f on (periodically) off off yes v por < v dd < v rst . power-fail detected. cpu goes into reset. power-fail monitor turns on periodically. g on on on v dd > v rst . crystal warmup time, t xtal_rdy . cpu resumes normal operation from 8000h. h on (periodically) off off yes v por < v dd < v rst . power-fail detected. cpu goes into reset. power-fail monitor turns on periodically. i off off off v dd < v por . device held in reset. no operation allowed.
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 25 table 5. stop mode power-fail detection states with power-fail monitor enabled figure 12. stop mode power-fail detection states with power-fail monitor enabled v pfw v rst v por a b c d e f v dd t < t pfw t t pfw t t pfw stop internal reset (active high) state power-fail internal regulator crystal oscillator sram retention comments a on off off yes application enters stop mode. v dd > v rst . cpu in stop mode. b on off off yes power drop too short. power-fail not detected. c on on on yes v rst < v dd < v pfw . power-fail warning detected. turn on regulator and crystal. crystal warmup time, t xtal_rdy . exit stop mode. d on off off yes application enters stop mode. v dd > v rst . cpu in stop mode. e on (periodically) off off yes v por < v dd < v rst . power-fail detected. cpu goes into reset. power-fail monitor turns on periodically. f off off off v dd < v por . device held in reset. no operation allowed.
16-bit microcontroller with infrared module MAXQ613 26 _____________________________________________________________________________________ figure 13. stop mode power-fail detection with power-fail monitor disabled table 6. stop mode power-fail detection states with power-fail monitor disabled v pfw v rst v por v dd a b c d e f stop interrupt internal reset (active high) state power-fail internal regulator crystal oscillator sram retention comments a off off off yes application enters stop mode. v dd > v rst . cpu in stop mode. b off off off yes v dd < v pfw . power-fail not detected because power-fail monitor is disabled. c on on on yes v rst < v dd < v pfw . an interrupt occurs that causes the cpu to exit stop mode. power-fail monitor is turned on, detects a power-fail warning, and sets the power-fail interrupt flag. turn on regulator and crystal. crystal warmup time, t xtal_rdy . on stop mode exit, cpu vectors to the higher priority of power-fail and the inter - rupt that causes stop mode exit.
16-bit microcontroller with infrared module MAXQ613 ______________________________________________________________________________________ 27 applications information the low-power, high-performance risc architecture of this device makes it an excellent fit for many portable or battery-powered applications. it is ideally suited for applications such as universal remote controls that require the cost-effective integration of ir transmit/ receive capability. grounds and bypassing careful pcb layout significantly minimizes system-level digital noise that could interact with the microcontroller or peripheral components. the use of multilayer boards is essential to allow the use of dedicated power planes. the area under any digital components should be a con - tinuous ground plane if possible. keep bypass capacitor leads short for best noise rejection and place the capaci - tors as close to the leads of the devices as possible. cmos design guidelines for any semiconductor require that no pin be taken above v dd or below gnd. violation of this guideline can result in a hard failure (damage to the silicon inside the device) or a soft failure (uninten - tional modification of memory contents). voltage spikes above or below the devices absolute maximum ratings can potentially cause a devastating ic latchup. microcontrollers commonly experience negative volt - age spikes through either their power pins or general- purpose i/o pins. negative voltage spikes on power pins are especially problematic as they directly couple to the internal power buses. devices such as keypads can conduct electrostatic discharges directly into the micro - controller and seriously damage the device. system designers must protect components against these tran - sients that can corrupt system memory. additional documentation designers must have the following documents to fully use all the features of this device. this data sheet contains pin descriptions, feature overviews, and elec - trical specifications. errata sheets contain deviations from published specifications. the users guides offer detailed information about device features and opera - tion. the following documents can be downloaded from www.maxim-ic.com/microcontrollers . ? this MAXQ613 data sheet, which contains electrical/ timing specifications, pin descriptions, and package information. ? the MAXQ613 revision-specific errata sheet ( www.maxim- ic.com/errata ). ? the maxq610 users guide , which contains detailed information on features and operation, including pro - gramming. table 6. stop mode power-fail detection states with power-fail monitor disabled (continued) state power-fail internal regulator crystal oscillator sram retention comments d off off off yes application enters stop mode. v dd > v rst . cpu in stop mode. e on (periodically) off off yes v por < v dd < v rst . an interrupt occurs that causes the cpu to exit stop mode. power-fail monitor is turned on, detects a power-fail, and puts cpu in reset. power-fail monitor is turned on periodically. f off off off v dd < v por . device held in reset. no operation allowed.
16-bit microcontroller with infrared module MAXQ613 28 _____________________________________________________________________________________ deviations from the maxq610 users guide for the MAXQ613 the maxq610 users guide contains all the informa - tion that is needed to develop application code for the MAXQ613 microcontroller. however, even though the maxq610 and the MAXQ613 are largely code-com - patible, there are certain differences between the two devices that must be kept in mind when referring to the maxq610 users guide . the following registers on the maxq610 (which are described in the maxq610 users guide ) do not exist on the MAXQ613, and all references to them should be disregarded: ? port 3 output register (po3) ? port 3 direction register (pd3) ? port 3 input register (pi3) ? port 4 output register (po4) ? port 4 direction register (pd4) ? port 4 input register (pi4) development and technical support maxim and third-party suppliers provide a variety of highly versatile, affordably priced development tools for this microcontroller, including the following: ? compilers ? in-circuit emulators ? integrated development environments (ides) ? serial-to-jtag and usb-to-jtag interface boards for programming and debugging (for microcontrollers with rewritable memory) a partial list of development tool vendors can be found at www.maxim-ic.com/maxq_tools . for technical support, go to https://support.maxim-ic. com/micro . package information for the latest package outline information and land patterns, go to www.maxim-ic.com/packages . note that a +, #, or - in the package code indicates rohs status only. package drawings may show a different suffix character, but the drawing pertains to the package regardless of rohs status. package type package code outline no. land pattern no. 32 tqfn-ep t3255+3 21-0140 90-0001 32 lqfp c32+2 21-0054 90-0111 44 tqfn-ep t4477+2 21-0144 90-0127 44 tqfp c44+2 21-0293 90-0316
16-bit microcontroller with infrared module MAXQ613 maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circuit patent licenses are implied. maxim reserves the right to change the circuitry and specifications without notice at any time. maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 29 ? 2010 maxim integrated products maxim is a registered trademark of maxim integrated products, inc. revision history revision number revision date description pages changed 0 7/10 initial release

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